The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6863796 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2005

Filed:

Jul. 02, 2002
Applicants:

Chia-liang Chueh, Jia-yi, TW;

Volume Chien, Taipei, TW;

Shih-ming Wang, Tainan, TW;

Inventors:

Chia-Liang Chueh, Jia-yi, TW;

Volume Chien, Taipei, TW;

Shih-Ming Wang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D005/48 ;
U.S. Cl.
CPC ...
Abstract

A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.


Find Patent Forward Citations

Chueh, Chia-Liang. (2005). Method for reducing cu surface defects following cu ecp (U.S. Patent No. 6863796). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6863796

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…