The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6861863 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 01, 2005

Filed:

Feb. 16, 2001
Applicants:

Shogo Ishioka, Fukayasu-gun, JP;

Tatuhisa Fujii, Fukuyama, JP;

Inventors:

Shogo Ishioka, Fukayasu-gun, JP;

Tatuhisa Fujii, Fukuyama, JP;

Assignee:

OHT Inc., Fukayasu-gun, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R031/02 ; H01R031/02 ;
U.S. Cl.
CPC ...
Abstract

An inspection apparatus is provided capable of adequately positioning an inspection chip to a conductive pattern as an inspection object. For connecting an electrode padof an inspection chipwith a leadof a package, bump electrodesandare first provided at the inspection chip and at the package, respectively. Then, an anisotropic conductoris provided to cover between the bump electrodesand, and a conductor filmis provided on the anisotropic conductorto extend between the bump electrodesand. The anisotropic conductoris thermo-compression bonded to provide an electrical connection between the conductor filmand the bump electrodesand. This structure may provide a desirable surface of the inspection chiphaving a sufficiently reduced thickness.


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