The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Feb. 14, 2003
Jae Myeong Song, Kyonggi-do, KR;
Chul Ho Ham, Kyonggi-do, KR;
Chan Ho Park, Chungchongnam-do, KR;
Eui Sung Hwang, Seoul, KR;
Woo Young Lim, Seoul, KR;
Jae Bong Seo, Kyonggi-do, KR;
Eung Yong Lee, Kyonggi-do, KR;
Byeng Gi Lee, Kyonggi-do, KR;
Jae Myeong Song, Kyonggi-do, KR;
Chul Ho Ham, Kyonggi-do, KR;
Chan Ho Park, Chungchongnam-do, KR;
Eui Sung Hwang, Seoul, KR;
Woo Young Lim, Seoul, KR;
Jae Bong Seo, Kyonggi-do, KR;
Eung Yong Lee, Kyonggi-do, KR;
Byeng Gi Lee, Kyonggi-do, KR;
LG Electronics Inc., Seoul, KR;
Abstract
A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range. The semiconductor device handler includes at least one enclosed chamber, a heating/cooling apparatus configured to bring an inside of the at least one chamber to a low or high temperature state, a pushing unit provided within the at least one chamber and configured to push a plurality of semiconductor devices mounted on a test tray into test sockets of a test board located within the at least one chamber for testing, a cooling fluid supplying apparatus configured to supply cooling fluid, a nozzle assembly configured to spray cooling fluid received from the cooling fluid supplying apparatus onto the semiconductor devices fitted to the test sockets, and a control unit configured to control spraying of cooling fluid onto the semiconductor devices during testing to compensate for temperature changes of the semiconductor devices that occur during testing.