The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Jun. 30, 2003
Hung-jen Hsu, Taoyuan, TW;
Chih-kung Chang, Hsin-Chu, TW;
Fu-tien Weng, Hsin-Chu, TW;
Te-fu Tseng, Hsin-Chu, TW;
Chin-chen Kuo, Hsin-Chu, TW;
Chiung-yuan Chang, Hsin-Chu, TW;
Hung-Jen Hsu, Taoyuan, TW;
Chih-Kung Chang, Hsin-Chu, TW;
Fu-Tien Weng, Hsin-Chu, TW;
Te-Fu Tseng, Hsin-Chu, TW;
Chin-Chen Kuo, Hsin-Chu, TW;
Chiung-Yuan Chang, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.