The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Apr. 18, 2002
Hideaki Hirabayashi, Oota-ku, JP;
Naoaki Sakurai, Yokohama, JP;
Toshitsura Cho, Kawasaki, JP;
Shumpei Shimizu, Kawasaki, JP;
Katsuhiro Kato, Kawasaki, JP;
Akiko Saito, Yokohama, JP;
Hideaki Hirabayashi, Oota-ku, JP;
Naoaki Sakurai, Yokohama, JP;
Toshitsura Cho, Kawasaki, JP;
Shumpei Shimizu, Kawasaki, JP;
Katsuhiro Kato, Kawasaki, JP;
Akiko Saito, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Tama Chemicals Co., Ltd., Kawasaki, JP;
Abstract
The copper-based metal polishing composition causes Cu or Cu alloy not to be dissolved at all in immersing Cu or Cu alloy therein, and makes it possible to polish Cu or Cu alloy at a high rate in polishing treatment. Such a copper-based metal polishing composition comprises a water-soluble first organic acid capable of reaction with copper to produce a copper complex compound which is substantially insoluble in water and has a mechanical strength lower than that of copper, at least one second organic acid selected from an organic acid having a single carboxyl group and a single hydroxyl group and oxalic acid, an abrasive grain, an oxidizing agent, and water.