The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6859023 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 22, 2005

Filed:

Aug. 15, 2002
Applicants:

Michinari Yamanaka, Osaka, JP;

Takayuki Yamada, Osaka, JP;

Hiroaki Nakaoka, Kyoto, JP;

Takeshi Yamashita, Osaka, JP;

Inventors:

Michinari Yamanaka, Osaka, JP;

Takayuki Yamada, Osaka, JP;

Hiroaki Nakaoka, Kyoto, JP;

Takeshi Yamashita, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R031/00 ; H01L021/00 ; H01L023/58 ;
U.S. Cl.
CPC ...
Abstract

A method for evaluating an insulating film includes: a first step of forming an insulating film on a semiconductor substrate including a p-n junction therein; a second step of selectively forming an electrode pattern on the insulating film; a third step of forming a measurement electrode on the insulating film so as to be electrically insulated from the electrode pattern; and a fourth step of applying a measurement voltage between the measurement electrode and the semiconductor substrate via the insulating film and measuring a leakage current leaking through the p-n junction so as to evaluate a damage to the insulating film or the semiconductor substrate.


Find Patent Forward Citations

Yamanaka, Michinari. (2005). Evaluation method for evaluating insulating film, evaluation device therefor and method for manufacturing evaluation device (U.S. Patent No. 6859023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6859023

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