The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2005

Filed:

Sep. 10, 2003
Applicant:

Kent Kuohua Chang, Taipei, TW;

Inventor:

Kent Kuohua Chang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/336 ;
U.S. Cl.
CPC ...
Abstract

A manufacturing method for a semiconductor device is provided, wherein a silicon germanium (SiGe; SiGe) layer and a strained silicon layer are sequentially formed on a semiconductor substrate. A gate oxide layer and a gate structure are further formed on the strained silicon layer. The gate structure and the strained silicon layer are heavily doped with n-type dopants to form a compressed gate and source/drain regions, respectively. A cap layer is further formed over the semiconductor substrate, followed by conducting an annealing process. The cap layer is subsequently removed.


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