The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Oct. 24, 2001
Hiroaki Inoue, Tokyo, JP;
Koji Mishima, Fujisawa, JP;
Tsutomu Karimata, Yokohama, JP;
Kenji Nakamura, Fujisawa, JP;
Moriji Matsumoto, Fujisawa, JP;
Junji Kunisawa, Yamato, JP;
Hiroaki Inoue, Tokyo, JP;
Koji Mishima, Fujisawa, JP;
Tsutomu Karimata, Yokohama, JP;
Kenji Nakamura, Fujisawa, JP;
Moriji Matsumoto, Fujisawa, JP;
Junji Kunisawa, Yamato, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to an electroless plating apparatus which can reduce an amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises: a holding device for holding a substrate with a surface, to be plated, facing upwardly; a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding device; an electroless plating treatment liquid supply device for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow supplied electroless plating liquid to be held on the substrate; and a heating apparatus provided below the substrate.