The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Nov. 20, 2003
Hee-jin Park, Chungcheongnam-do, KR;
Tae-gyeong Chung, Kyungki-do, KR;
Eun-chul Ahn, Chungcheongnam-do, KR;
Hee-Jin Park, Chungcheongnam-do, KR;
Tae-Gyeong Chung, Kyungki-do, KR;
Eun-Chul Ahn, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.