The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Feb. 13, 2001
Hiroshi Haji, Fukuoka, JP;
Shoji Sakemi, Fukuoka, JP;
Mitsuru Ozono, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Kiyoshi Arita, Fukuoka, JP;
Hiroshi Haji, Fukuoka, JP;
Shoji Sakemi, Fukuoka, JP;
Mitsuru Ozono, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Kiyoshi Arita, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
The method of manufacturing a semiconductor device of the present invention comprises: forming a resin layer on a surface of a semiconductor wafer on which a plurality of semiconductor elements are formed, forming through-holes on the resin layer, a first cutting of either the semiconductor wafer or the resin layer, mounting conductive balls on the through-hole, connecting the conductive ball to electrodes of the semiconductor element, and a second cutting for dividing the wafer into each piece of semiconductor devices. With the processes of the present invention, conductive balls can be easily and effectively mounted on a wafer under optimum conditions, without failure such as slipping or falling down from the required position. This fact contributes to an increased efficiency and a good productivity in the production of semiconductor devices.