The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Jun. 14, 2001
Michio Horiuchi, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Shigeru Mizuno, Nagano, JP;
Shinko Electric Industries Co., LTD, Nagano, JP;
Abstract
To minimize a size of a semiconductor device and reduce a thickness thereof as well as improve the yield and lower the production cost in the production of a semiconductor package, a multi-layered semiconductor device is provided, wherein a film-like semiconductor package () incorporating therein a semiconductor chip () is disposed in a package accommodation opening () of a circuit pattern layer to form a circuit board. A plurality of such circuit boards are layered together to electrically connect circuit patterns () of the circuit boards with each other via a low melting point metal () or lead beam bonding ().