The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
May. 30, 2003
Jong-myeong Lee, Kyungki-do, KR;
Byung-hee Kim, Seoul, KR;
Myoung Bum Lee, Seoul, KR;
Ju-young Yun, Seoul, KR;
Gil-heyun Choi, Kyungki-do, KR;
Jong-myeong Lee, Kyungki-do, KR;
Byung-hee Kim, Seoul, KR;
Myoung bum Lee, Seoul, KR;
Ju-young Yun, Seoul, KR;
Gil-heyun Choi, Kyungki-do, KR;
Abstract
An integrated in situ cluster type wafer processing apparatus which can be used for forming metal wiring layers having a multi-layered structure and a wafer processing method using the same are provided. The wafer processing apparatus includes a transfer chamber which can be exhausted and has a plurality of gate valves, a plurality of vacuum processing chambers each of which can be connected to the transfer chamber via one of the gate valves, and a load lock chamber which can be exhausted and is connectable to a first gas feed line for feeding an oxygen-based gas into the load lock chamber. In a wafer processing method, a predetermined layer is formed on a wafer in one of the vacuum processing chambers. The predetermined layer on the wafer is oxidized in the load lock chamber or an oxygen atmosphere chamber.