The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Apr. 09, 2004
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Pierre-marie Piel, Tempe, AZ (US);
Garry D. Funk, Scottsdale, AZ (US);
Robert Paul Davidson, Chandler, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Pierre-Marie Piel, Tempe, AZ (US);
Garry D. Funk, Scottsdale, AZ (US);
Robert Paul Davidson, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (), an electronic device () over the support substrate, and a cover () located over the electronic device and the support substrate. The cover includes an interconnect structure () electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.