The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Feb. 04, 2003
Chad A. Cobbley, Boise, ID (US);
Michael B. Ball, Boise, ID (US);
Marjorie L. Waddel, Boise, ID (US);
Chad A. Cobbley, Boise, ID (US);
Michael B. Ball, Boise, ID (US);
Marjorie L. Waddel, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile