The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Sep. 27, 2002
Tadatomi Nishikubo, Fujisawa, JP;
Atsushi Kameyama, Yokohama, JP;
Masaki Sasaki, Asaka, JP;
Masatoshi Kusama, Sakaido, JP;
Seiya Onodera, Sayama, JP;
Tadatomi Nishikubo, Fujisawa, JP;
Atsushi Kameyama, Yokohama, JP;
Masaki Sasaki, Asaka, JP;
Masatoshi Kusama, Sakaido, JP;
Seiya Onodera, Sayama, JP;
Kanagawa University, , JP;
Abstract
A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.