The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6843707 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 18, 2005

Filed:

Nov. 18, 2003
Applicants:

Miguel Angel Saldana, Fremont, CA (US);

Damon Vincent Williams, Fremont, CA (US);

Inventors:

Miguel Angel Saldana, Fremont, CA (US);

Damon Vincent Williams, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 719 ;
U.S. Cl.
CPC ...
Abstract

CMP methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface of a wafer carrier so that a wafer axis of rotation is gimballed for universal movement relative to a spindle axis of rotation of a wafer spindle. An operation using a retainer ring limits wafer movement on the carrier surface perpendicular to the wafer axis. Another operation limits a direction of permitted movement between the wafer carrier and the retainer ring to only movement parallel to the wafer axis, so that a wafer plane and a retainer ing may be co-planar.


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Saldana, Miguel. (2005). Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing (U.S. Patent No. 6843707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6843707

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