The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Mar. 16, 2004
Labeeb Sadak Thamby, Hong Kong, HK;
Neil Mclellan, Hong Kong, HK;
Hugo Chi Wai Wong, Hong Kong, HK;
William Lap Keung Chow, Hong Kong, HK;
Labeeb Sadak Thamby, Hong Kong, HK;
Neil McLellan, Hong Kong, HK;
Hugo Chi Wai Wong, Hong Kong, HK;
William Lap Keung Chow, Hong Kong, HK;
Asat Ltd., New Territories, HK;
Abstract
A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of said package body to an exterior thereof; mounting a semiconductor die to said die attach pad; wire bonding various ones of said leads to said semiconductor die; adding a fill material for covering at least a surface of said interior portion of said leads; and mounting a lid on said package body for enclosing said die in said cavity of said package body.