The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Mar. 30, 2001
Applicants:
Masanori Akita, Otsu, JP;
Toshihiro Mori, Moriyama, JP;
Koji Ito, Otsu, JP;
Inventors:
Assignee:
Toray Engineering Company, Limited, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2148 ;
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.