The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Nov. 25, 2002
Gu-Sung Kim, Kyungki-do, KR;
Dong-Hyeon Jang, Kyungki-do, KR;
Min-Young Son, Kyungki-do, KR;
Sa-Yoon Kang, Kyungki-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A thermal-stress-absorbing interface structure is provided between a semiconductor integrated circuit chip and a surface-mount structure. The interface structure comprises an elongated conductive-bump pad having a first length-wise end and a second length-wise end, and a side. The pad has an interconnection line extending from the side thereof intermediate the first and the second ends. The interconnection line is electrically connected to the chip. The interface structure further includes a first polymer layer having an exposed surface, and a second polymer layer, each having a different modulus of elasticity, disposed below the pad. The second polymer layer extends over substantially the entire exposed surface of the first polymer layer to absorb a thermal stress during thermal cycling.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile