The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Sep. 26, 2003
Li-Te S. Lin, Hsinchu, TW;
Chin-Chiu Hsia, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of measuring the stress migration of vias, and a the structure, the method comprising the following steps. A metal line having a middle and opposing first and second ends is formed. First and second opposing pads electrically connected to the respective opposing first and second ends of the metal line through respective first and second step-width line structures are formed. A third pad connected to the metal line proximate its first end by a first via through a first metal structure is formed. A fourth pad connected to the metal line proximate its second end by a second via through a second metal structure is formed. The first and second vias are equidistant from the respective first and second ends of the metal line. The stress migration of the first via is determined by measuring the: sheet resistance between the first pad and the third pad; and/or the stress migration of the second via is determined by measuring the sheet resistance between the fourth pad and the second pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile