The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Aug. 21, 2003
Tsutomu Higuchi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
There is provided a semiconductor package that includes a metal plate, and a wiring substrate having an insulating substrate, signal wiring layer formed on one surface of the insulating substrate, and a ground plane formed integrally on other surface of the insulating substrate, whereby a surface of the ground plane side of the wiring substrate is adhered onto the metal plate. The signal wiring layer is constructed by a wiring line portion and a connection pad portion whose width is thicker than a width of the wiring line portion, and non-forming portion is provided in portion of the ground plane, which corresponds to the connection pad portion. In addition, a recess portion may be formed in portion of the metal plate, which correspond to the non-forming portion.