The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Dec. 17, 2001
Applicant:
Inventors:
Ryo Enomoto, Gifu, JP;
Masanori Tamaki, Gifu, JP;
Assignee:
Ibiden Co., Ltd., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract
Each via hole of a printed wiring board is filled with a metal conductor. A distal end of each metal conductor is covered with a diffusing metal layer. The distal end of the metal conductor is pressed against a conductor circuit of another substrate, and the printed wiring boards are bonded together by thermocompression bonding. The metal of the distal end of each metal conductor is diffused into the metal of the conductor circuit so that an alloy layer is formed in an interface. As a result, reliability in the interlayer electrical connection can be improved.