The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Dec. 04, 2001
Bernard Foster, Elkton, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington, DE (US);
Abstract
A polishing pad installation tool comprised of a base portion and at least one compressible layer in operative connection with the base portion. The compressible layer includes a plurality of apertures through an upper surface of the compressible layer. The tool further includes a plurality of parallel pins extending outwardly from the base portion through the apertures of the compressible layer. Each of the pins includes a collar portion in surrounding relation about each pin. When the compressible layer is in an uncompressed condition, the collar portions are beneath the upper surface of the compressible layer. The pins are positioned on the base portion in a pattern which corresponds to the holes in the polishing platen. The pins have diameters which are smaller than the diameters of the holes in a polishing pad. The collars have diameters larger than the diameters of the holes in the polishing pad. As the pins of the tool enter the holes of the polishing pad, the compressible layer of the tool compresses against the polishing surface of the pad to adhesively bond the polishing pad to the polishing platen. The collar portions of the pins are operative to press against the edges of the holes of the polishing pad to seal the hole edges adjacent the polishing platen.