The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2004

Filed:

Nov. 22, 2002
Applicant:
Inventors:

Ching-Lun Lai, Taichung, TW;

Shi-Wei Wang, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
U.S. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
Abstract

A method for forming a composite dielectric layer within a microelectronic product provides a first dielectric layer formed over a substrate of a fluorosilicate glass (FSG) dielectric material deposited employing a high density plasma chemical vapor deposition (HDP-CVD) method. The method also provides a second dielectric layer formed over the first dielectric layer and formed of an undoped silicate glass (USG) dielectric material deposited employing a HDP-CVD source radio frequency power only method employing a source radio frequency power of from about 1000 to about 5000 watts absent a bias power. The composite dielectric layer is formed with inhibited cracking.


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