The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2004

Filed:

Aug. 15, 2002
Applicant:
Inventors:

Makoto Kobayashi, Nishishirakawa-gun, JP;

Kazuhito Matsukawa, Tokyo, JP;

Hidekazu Yamamoto, Tokyo, JP;

Shinroku Maejima, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; G06F 1/900 ;
U.S. Cl.
CPC ...
H01L 2/100 ; G06F 1/900 ;
Abstract

There are provided a method and an apparatus for evaluating a wafer configuration which can accurately evaluate a peripheral portion of a wafer as compared with the conventional SFQR or the like, which comprises: measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer; providing a first region (W ) within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration; calculating a reference line ( ) or a reference plane ( ) in the first region (W ); providing a second region (W ) to be evaluated outside the first region; extrapolating the reference line ( ) or reference plane ( ) to the second region (W ); analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and calculating the analyzed difference as surface characteristics.


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