The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Sep. 28, 2001
Etsuo Kiuchi, Gunma, JP;
Toshiyuki Hayashi, Gunma, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table( ); and a work holding plate( ), wherein a work held on the work holding plate( ) is polished supplying a polishing agent solution( ) in the apparatus, and in polishing action, an amount of deformation of the polishing table( ) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate( ) in a direction normal to a work holding surface thereof is restricted to 100 &mgr;m or less by forming the polishing table( ) in one-piece, contriving flow paths of cooling water and others.