The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2004

Filed:

May. 23, 2002
Applicant:
Inventor:

Kei-Wean C. Yang, Beaverton, OR (US);

Assignee:

Tektronix, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/36 ; H01R 1/3514 ;
U.S. Cl.
CPC ...
G02B 6/36 ; H01R 1/3514 ;
Abstract

A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements. The standoff dielectric substrate is positioned in an abutting relationship with one of the electrical elements. The standoff dielectric substrate and the first and second electrical elements are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.


Find Patent Forward Citations

Yang, Kei-Wean. (2004). Butt joined electronic assembly and module having an electrical standoff (U.S. Patent No. 6827504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6827504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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