The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
May. 07, 2003
Serafin P. Pedron, Jr., Manteca, CA (US);
ASAT Ltd., New Territories, HK;
Abstract
An integrated circuit package includes a substrate having conductive traces therein. A first semiconductor die is mounted in a die-down configuration to a first surface of the substrate. A second semiconductor die is mounted to a backside of the first semiconductor die. A plurality of connectors electrically connect the first semiconductor die to portions of the conductive traces of the substrate and a plurality of wire bonds connect the second semiconductor die to other portions of the conductive traces of the substrate. An encapsulant encapsulates the wire bonds and covers at least a portion of the first surface of the substrate and the second semiconductor die. A ball grid array is disposed on a second surface of the substrate, bumps of the ball grid array being connected with the conductive traces.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile