The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2004

Filed:

May. 23, 2003
Applicant:
Inventors:

Sang-su Kim, Suwon, KR;

Geum-jong Bae, Suwon, KR;

Ki-chul Kim, Suwon, KR;

Jung-il Lee, Kimcheon, KR;

Hwa-sung Rhee, Kwanak-gu, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/13205 ; H01L 2/14763 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/13205 ; H01L 2/14763 ; H01L 2/144 ;
Abstract

Provided is a method for fabricating a semiconductor device. According to the method, an insolating layer which defines an active region on a semiconductor substrate is formed and a gate is formed on the active region of the semiconductor substrate. A first spacer layer which covers the gate and is extended to cover the isolating layer is formed as a first insulating material. A second spacer layer is formed on the first spacer layer as a second insulating material. A second spacer which remains on the sidewalls of the gate by removing some portions of the second spacer layer is formed. A first spacer by a portion of the first spacer layer, which is protected by the second spacer by partially etching the exposed portions of the first spacer layer using the second spacer as a mask so as to reduce the thickness of the first spacer layer, and a protection layer, which protects the insulating layer by remaining the portion of the first spacer of which thickness is reduced, are formed. The second spacer is selectively removed and a gate spacer of the first spacer is formed by removing the remaining protection layer.


Find Patent Forward Citations

Loading…