The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Mar. 10, 2003
Addi B. Mistry, Austin, TX (US);
Joseph M. Haas, Austin, TX (US);
Dennis O. Kiffe, Leander, TX (US);
James H. Kleffner, Leander, TX (US);
Daryl R. Wilde, Cedar Park, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor package assembly has an intervening package ( ) that may be connected to a first package ( ) from a first substrate ( ) on a first side of the package ( ) and to a second package ( ) from a second substrate ( ) on a second, opposing side of the package ( ). Electrical contact to a semiconductor die ( ) is made from the first side by wire bonding to wire bond posts ( ) and by balls ( ) from the second side. Electrical contact from one side of the intervening package ( ) to the other may be made by bypassing the die. Electrical contact on either side of the intervening package may be made both within and outside the footprint of the semiconductor die ( ).