The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Dec. 31, 2002
Applicant:
Inventors:
Uwe Wellhausen, Kanagawa, JP;
Stefan Gernhardt, Kanagawa, JP;
Rainer Bruchhaus, Kanagawa, JP;
Andreás Hilliger, Kanagawa, JP;
Jing Yu Lian, Tokyo, JP;
Nicolas Nagel, Kanagawa, JP;
Assignee:
Infineon Technologies Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
A semiconductor chip in which stress on the effective stress on the substrate is reduced in order to reduce bowing. To reduce the effective stress, a stress compensation layer is provided on the backside of the chip. The stress compensating layer produces a stress opposite of that produced by the IC. Thus the overall or effective stress on the substrate is reduced.