The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6814804 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 09, 2004

Filed:

Apr. 11, 2002
Applicant:
Inventors:

Hiroaki Onishi, Higashiosaka, JP;

Shoji Sato, Neyagawa, JP;

Takao Naito, Yamanashi-ken, JP;

Takaaki Higashida, Kadoma, JP;

Akira Kabeshita, Hirakata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 1/102 ;
U.S. Cl.
CPC ...
B05C 1/102 ;
Abstract

A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is scraped by the scraping squeegee. The solder paste is prevented from being improperly filled in or scraped from the openings even if a speed of the squeegee is increased, so that the solder paste can be printed stably on circuit board.


Find Patent Forward Citations

Onishi, Hiroaki. (2004). Apparatus and method for printing solder paste (U.S. Patent No. 6814804). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6814804

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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