The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Dec. 19, 2000
Applicant:
Inventors:
Kiyotaka Tsukada, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Kenji Chihara, Ogaki, JP;
Naoto Ishida, Ogaki, JP;
Atsushi Shouda, Ogaki, JP;
Assignee:
Ibiden Co., Ltd., Ogaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A printed circuit board providing superior adhesion between a substrate and a conductor pattern and preventing damage of the substrate . The width c of the bottom surface of the conductor pattern is greater than the width d of the top surface . Accordingly, the conductor pattern has a trapezoidal cross-section. The two side surfaces of a lower portion of the conductor pattern are coated by a solder resist. The two side surfaces at the upper portion of the conductor pattern are exposed from the solder resist . A solder ball engages the two side surfaces