The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Aug. 28, 2000
Applicant:
Inventors:
Wing Cheung Ho, Kwai Chung, HK;
Siu Yan Ho, Kwai Chung, HK;
Hon Shing Law, Kwai Chung, HK;
Siu Wai Chung, Kwai Chung, HK;
Assignee:
ASM Assembly Automation Ltd., Kwai Chung, HK;
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/700 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/700 ; B23K 3/102 ;
Abstract
Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.