The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Nov. 27, 2002
Steven N. Towle, Phoenix, AZ (US);
Anna M. George, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment there is provided a method comprising performing a singulation operation on a wafer; and treating the wafer to at least reduce a propagation of micro-cracks formed in the wafer during the singulation. In another embodiment there is provided a semi-conductor die comprising a substrate having a central first portion, and a peripheral second portion around the central first portion; an integrated circuit formed on the central first portion; and a guard ring disposed between the first and second portions of the substrate to prevent a propagation of micro-cracks formed in the second portion into the first portion, the micro-cracks having been formed during a singulation operation to separate the semiconductor die from a wafer, wherein the second portion includes micro-cracks filled with a crack-healing material to arrest propagation of the micro-cracks beyond the ring and into the central first portion.