The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
May. 13, 2002
Satoshi Fujii, Itami, JP;
Noboru Gotou, Itami, JP;
Tomoki Uemura, Itami, JP;
Toshiaki Saka, Itami, JP;
Katsuhiro Itakura, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A method for separating chips from a diamond wafer comprising a substrate, a chemically vapor-deposited diamond layer, and microelectronic elements, with the microelectronic elements protected from thermal damage and degradation caused by the thermally decomposed cuttings produced during the processing steps. (1) Front-side grooves are formed on the chemically vapor-deposited diamond layer by laser processing using a laser such as a YAG, CO , or excimer laser each having a large output so that the grooves can have a depth 1/100 to 1.5 times the thickness of the diamond layer. (2) The thermally decomposed cuttings produced during the laser processing are removed by using a plasma. (3) Back-side grooves are formed on the substrate by dicing such that the back-side grooves are in alignment with the front-side grooves . (4) The diamond wafer is divided into individual chips by applying mechanical stresses.