The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Aug. 05, 2002
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device comprises a semiconductor element, a heat sink soldered to one surface of the semiconductor element, and a heat sink soldered to an opposite surface of the semiconductor element. The semiconductor element is provided with a wiring layer. The wiring layer is covered with an insulating protective film. The protective film is an organic film. The thickness of the wiring layer and that of the protective film are assumed to be t and t , respectively. The wiring layer and the protective film are formed so as to establish a relationship of t <t . An elastic modulus of the protective film at room temperature is adjusted to 1.0-5.0 GPa and a thermal expansion coefficient of the protective film is adjusted to 35-65×10 /° C. Even under a thermal stress the semiconductor device can diminish a short-circuit defect of the wiring layer.