The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Sep. 17, 2001
Applicant:
Inventors:
Assignee:
Advanced Technology Materials, Inc., Danbury, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 3/700 ; B01D 2/126 ;
U.S. Cl.
CPC ...
B01D 3/700 ; B01D 2/126 ;
Abstract
A method and system for separating impurities, such as large abrasive particles and foreign matter from an abrasive polishing slurry prior to a Chemical Mechanical Polishing (CMP) procedure performed on a surface of a semiconductor wafer. Impurities greater than about 25 microns are removed by an initial filtration process. The filtrate is then introduced to a solid bowl, sedimentation-type centrifuge to remove particles greater than 0.5 microns thereby providing a polishing slurry for final utilization in a CMP procedure that reduces damage to the surface of the polished semiconductor wafer.