The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2004
Filed:
Aug. 23, 2001
Applicant:
Inventors:
Ying Ma, Weatherford, TX (US);
Michael Jones, Phoenix, AZ (US);
Thomas H. Baum, New Fairfield, CT (US);
Deepak Verma, Scottsdale, AZ (US);
David Bernhard, Newtown, CT (US);
Assignee:
Advanced Technology Materials, Inc., Danbury, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 1/300 ;
U.S. Cl.
CPC ...
C09K 1/300 ;
Abstract
An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.
Ma, Ying. (2004). Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same (U.S. Patent No. 6800218). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6800218
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile