The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
Nov. 16, 2001
Seiichi Nakatani, Osaka, JP;
Yoshihiro Bessho, Osaka, JP;
Yasuhiro Sugaya, Osaka, JP;
Keiji Onishi, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
At least two electric elements ( ) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns ( ), and the electric elements ( ) are sealed with a thermosetting resin composition ( ). An upper surface of the at least two electric elements ( ) and an upper surface of the thermosetting resin composition ( ) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition ( ), it is possible to reduce the thickness without damaging the electric elements ( ). Also, the electric elements ( ) and the wiring patterns ( ) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.