The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
Mar. 26, 2002
Jacek Budny, Gdynia, PL;
Gerard Wisniewski, Gdansk, PL;
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic package for providing an increased density of electronic components in systems includes electronic components mounted on two surfaces of a substrate. Electrical coupling is provided by electrical contacts mounted with substantially the same arrangement and number on both surfaces of the substrate. Two conductive substrates having apertures are mounted adjacent and substantially parallel to the two component mounting surfaces such that the electrical contacts mounted on the two surfaces protrude through the apertures of the two conductive substrates. The two conductive substrates are coupled to one or more heat sinks to conduct heat away from the multiple electronic components contained between the conductive substrates. Multiple electronic packages can be coupled together to form a stacked electronic package by physically connecting the electrical contacts of the electronic packages.