The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
May. 15, 2002
Applicant:
Inventors:
Masaaki Ishizaka, Yokohama, JP;
Yumio Nakamura, Nagano, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract
A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.