The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
Jul. 17, 2002
Dong Whee Kwon, Kyunggi-do, KR;
Jin Hyuk Lee, Seoul, KR;
Yun Heub Song, Kyunggi, KR;
Sa Yoon Kang, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
Devices that have bonding pads, and methods for fabricating the same. The bonding pads have two conductive layers, and an intermediate layer between them. The intermediate layer has a hybrid configuration of a relatively large conductive plate section, and a mixed plugs/mesh section. The plugs/mesh section has conductive portions interspersed with non-conducting portions, with features that are relatively small in size. The hybrid configuration achieves a proper balance between the plate section for the main electrical contact, and the plugs/mesh section for support and additional current density.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile