The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
Mar. 25, 2002
Junpei Kusukawa, Hitachi, JP;
Ryozo Takeuchi, Hitachi, JP;
Toshiaki Ishii, Hitachi, JP;
Hiromichi Suzuki, Tokyo, JP;
Fujio Ito, Hanno, JP;
Takafumi Nishita, Iruma, JP;
Akihiko Kameoka, Ogose, JP;
Masaru Yamada, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
At least a part of the inner leads of a lead frame is covered with a plating for a metallic fine wire connection, at least the entire portion where the lead frame joins with the adhesive layer is covered by at least one metal or alloy thereof different from the metallic fine wire connecting use plating. The metal or alloy is selected from the group consisting of gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium and zirconium. Thereby, generation of defects, such as leakage and shorting, due to ion migration can be prevented.