Opto-electronic device integration

Abstract

A method for creating a hybridized chip by combining a bottom active optical device and an electronic chip when at least some of the active device contacts are not aligned with at least some of the electronic chip contacts. The method involves adding an insulating layer, having a thickness, a first side and a second side, to the bottom active optical device by affixing the first side to the surface, openings in the insulating layer extending from the second side to the first side at points substantially coincident with the active device contacts, making the sidewalls electrically conductive, and connecting the points and the electronic chip contacts with an electrically conductive material. A hybridized chip has at least one bottom active optical device coupled to an electronic chip, the hybridized chip having been created using a described method. A method of connecting two chips, each having electrically corresponding contacts to be joined together but are physically mismatched relative to each other. The method involves creating electrically conductive paths on an insulator, each of the electrically conductive paths extending between physical locations of contacts of one of the two chips and physical locations of the electrically corresponding contacts on the other of the two chips.