The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2004

Filed:

Dec. 11, 2003
Applicant:
Inventors:

Tony Mule′, Atlanta, GA (US);

James D. Meindl, Marietta, GA (US);

Paul Kohl, Atlanta, GA (US);

Stephen M. Schultz, Tucson, AZ (US);

Thomas K. Gaylord, Atlanta, GA (US);

Elias N. Glytsis, Dunwoody, GA (US);

Ricardo Villalaz, Atlanta, GA (US);

Muhannad Bakir, Atlanta, GA (US);

Hollie Reed, Smyrna, GA (US);

Assignee:

Georgia Tech Research Corp., Atlanta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/00 ;
U.S. Cl.
CPC ...
G02B 6/00 ;
Abstract

Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.


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