The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Feb. 11, 2003
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/940 ;
Abstract
A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.
Otani, Hiroyuki. (2004). Semiconductor chip—mounting board (U.S. Patent No. 6787922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6787922
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile