The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Mar. 27, 2002
Applicant:
Inventor:
Vincent Fortin, Santa Clara, CA (US);
Assignee:
Mosel Vitelic, Inc., Hsuin Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
An interconnect for a substructure having an opening ( ) with a rounded perimetrical top edge ( ) includes a titanium nitride layer ( ) and a tungsten layer ( ). The titanium layer overlies the substructure, extends into the opening, has a substantially columnar grain structure, and is less than nm thick. The tungsten layer overlies/contacts the titanium nitride layer and extends into the opening. A titanium layer ( ) normally no more than 36 nm thick is typically situated between the substructure and the titanium nitride layer.