The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Nov. 22, 2002
Satoshi Koyama, Tokyo, JP;
Tetsuo Sato, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A main circuit block and a sub-circuit block are located alongside of each other on a substrate of a semiconductor integrated circuit device. A plurality of bonding pads, which are connected to external leads of the device, are disposed around the main circuit block. A plurality of first wires are disposed extending from the main circuit block into space between the bonding pads. Each wire has a shape connectable to another wire, for example the wire has a tip having a portion perpendicular to the semiconductor substrate, or the wire has a tip having a cross-wire portion which intersect with an extended line of the wire. A plurality of second wires are extended from the sub-circuit block, and each electrically connected to one of the first wires.