The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
May. 13, 2002
Yung-Min Cheng, Yung Kang, TW;
Yao-Tung Liu, Hsinchu, TW;
Chun-Tsung Yang, Tainan, TW;
Juei-Feng Hsu, Tainan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Abstract
Within a method for electrical testing a series of microelectronic fabrication die fabricated within a microelectronic fabrication substrate, there is first electrically tested the series of microelectronic fabrication die to determine at least one sub-series of electrically unacceptable microelectronic fabrication die. Similarly, there is also determined whether the microelectronic fabrication substrate may be reworked. Finally, there is also electrically retested only the at least one sub-series of electrically unacceptable microelectronic fabrication die, and only if the microelectronic substrate may be reworked. The method provides for enhanced efficiency when electrically testing the series of microelectronic fabrication die.